|
PCB
Capability
|
|
Capability
|
MIN/MAX |
Regular |
|
Number
of Layers |
2¡32L |
2¡24L |
|
Max. board
size |
510×610§® |
|
|
Minimum
Conductor Width/Spacing |
3mil |
4¡8mil |
|
Maximum
Aspect Ratio |
12 |
¡Ã10 |
|
Minimum
Drill Size |
Ø 0.25 |
Ø 0.3¡Â |
|
Maximum
Drill Size |
Ø 6.50 |
|
|
Controlled
Impedance, Tolerance |
± 8
% |
±
10 % |
|
Warp/Twist |
0.5% |
1.0% |
|
Feature
to Feature Tolerance |
±4mil |
±6mil¡Â |
|
Hole to
Feature Tolerance |
±4mil |
±6mil¡Â |
|
Hole to
Hole Tolerance |
±3mil |
±4mil¡Â |
|
Method & Product |
D/S
, MLB
EPS-BGA, Flexible, Probe-card, etc... |
|
|
|
Minimum Board Thickness
|
| Double
Side |
4Layer |
6Layer |
8Layer |
| 0.008£¢ |
0.016£¢ |
0.02£¢ |
0.028£¢ |
| 0.2§® |
0.4§® |
0.5§® |
0.7§® |
|
|
|
Surface Mounting
Tech
|
| Min. PITCH |
15mil |
| Min. Space |
8mil |
|
|
Tolerance
|
| Fab.
Dimension |
±0.10§® |
| Board Thickness |
±10% |
| Controlled
Impedance |
±10% |
|
|
Solder Mask
|
| Solder
Mask Type |
Thickness |
| DSR 2200ST-1 |
12§ |
| OPSR 5800 |
15§ |
|
|
Ni/Au Plating Process
|
| Type of
Plating Process |
Thickness |
| Electrical
Ni/Au Plating |
Max. 1.3§ |
| Chemical
Ni/Au Plating |
Max. 1.0§ |
|
|
Surface Finishing
Process
|
| Surface
Finishing Type |
Thickness |
| HASL(Hot
Air Solder Leveling) |
2¡20§ |
| Organic
Coating |
0.3¡0.5§ |
|
