|
생산 능력
|
|
Capability
|
MIN/MAX |
Regular |
|
Number
of Layers |
2∼32L |
2∼24L |
|
Max. board
size |
510×610㎜ |
|
|
Minimum
Conductor Width/Spacing |
3mil |
4∼8mil |
|
Maximum
Aspect Ratio |
12 |
≥10 |
|
Minimum
Drill Size |
Ø 0.25 |
Ø 0.3≤ |
|
Maximum
Drill Size |
Ø 6.50 |
|
|
Controlled
Impedance, Tolerance |
± 8
% |
±
10 % |
|
Warp/Twist |
0.5% |
1.0% |
|
Feature
to Feature Tolerance |
±4mil |
±6mil≤ |
|
Hole to
Feature Tolerance |
±4mil |
±6mil≤ |
|
Hole to
Hole Tolerance |
±3mil |
±4mil≤ |
|
Material |
Glass Epoxy,
FR-4, CEM-3, BT-RESIN
TEforn, High Tg
FR-4 |
|
|
|
최소 기판 두께
|
| Double
Side |
4Layer |
6Layer |
8Layer |
| 0.008＂ |
0.016＂ |
0.02＂ |
0.028＂ |
| 0.2㎜ |
0.4㎜ |
0.5㎜ |
0.7㎜ |
|
|
|
표면 처리 기술
|
| Min. PITCH |
15mil |
| Min. Space |
8mil |
|
|
편차
|
| Fab.
Dimension |
±0.10㎜ |
| Board Thickness |
±10% |
| Controlled
Impedance |
±10% |
|
|
Solder Mask
|
| Solder
Mask Type |
Thickness |
| DSR 2200ST-1 |
12㎛ |
| OPSR 5800 |
15㎛ |
|
|
Ni/Au Plating Process
|
| Type of
Plating Process |
Thickness |
| Electrical
Ni/Au Plating |
Max. 1.3㎛ |
| Chemical
Ni/Au Plating |
Max. 1.0㎛ |
|
|
Surface Finishing
Process
|
| Surface
Finishing Type |
Thickness |
| HASL(Hot
Air Solder Leveling) |
2∼20㎛ |
| Organic
Coating |
0.3∼0.5㎛ |
|
